For me, nothing beats grinding through challenging complex projects alongside hard-charging team-members to achieve a common goal, making a dream into reality. Whether managing projects stateside or leading teams overseas, I love finding solutions to complicated issues.

Experience

MetaTechnical Program Manager - AI Rack/Power Platforms

2025 — Now

Menlo Park, California, United States

WaymoTechnical Program Manager - Compute Systems

2023 — 2025

Mountain View, California, United States

Amazon Lab126Technical Program Manager, Hardware Sustainability

2022 — 2023

United States

Managed sustainability efforts for over 25 products, including Echo earbuds, smart speakers, wearables and tablets.

Led hardware and software mitigation plans through cross-functional coordination with internal/external partners.

Implemented optimized FA protocols resulting in 10% test time reduction and 15% improved response time.

Developed JIRA projects/sprints to monitor safety issues on high-volume production devices, using dynamic dashboards to track data metrics.

Coordinated build schedules with CMs in APAC/NORAM regions, successfully identifying manufacturing errors and implementing technical fixes.

Skills: Agile Project Management · Electronics · Printed Circuit Board (PCB) Design · Program Management · Jira · Failure Mode and Effects Analysis (FMEA)

MetaEngineering Program Manager - Silicon Engineering AR/VR

2020 — 2022

Sunnyvale, California, United States

Led successful development of custom ASICs and PMICs manufacturing to support AR/VR micro-LED display modules, achieving 96% on-time delivery.

Oversaw end-to-end package development for Reliability qualification, characterization, and validation, optimizing PCB footprint and resulting in improved assembly yield.

Established efficient tester line setup and custom PCBA/test board builds, contributing to a 20% increase in assembly yield.

Coordinated multi-company contract negotiation for new research ASIC project, managing vendor relationships from onboarding to clear-to-build.

Managed communication between 20+ vendors throughout display module builds, working with GSM, silicon architects, packaging engineers, and operations teams.

Developed dynamic dashboards for metrology, yield, and electrical test data collection, optimizing silicon architecture.

Managed $100+ million product development projects/build plans, including SOWs, BOMs, POs, and budget planning.

Area of focus: Backplane ASIC testing and product development for next generation AR/VR devices. Led NPI/NTI team from Tape-out through Ramp up/MP stages for Module builds.