• Full Product Lifecycle Ownership: Delivered 3rd-gen Foveros Lunar Lake platform from pathfinding through development to high-volume manufacturing (HVM), achieving a successful product launch. Currently initiating Intel 18A Panther Lake platform as the successor to Lunar Lake, driving next-generation advancements in package design and manufacturing.

• First-of-its-Kind Product Architecture: Developed pioneering technologies, including memory-on-package integration and hybrid Surface Mount Technology (SMT) enablement, setting a unique product architecture.

• High-Volume Ramp-Up & Supplier Coordination: Managed high-volume ramp-up with partners and suppliers, facilitating knowledge transfer and process optimization for consistent and cost-effective production.

• Specification Definition & Quality/Reliability Certification: Defined and validation product specifications to meet diverse operational requirements. Led risk management efforts at both the system and component levels, conducting extensive reliability validation and leveraging failure analysis (FA) to address package-to-system integration challenges, ensuring product certification in alignment with intended use conditions.

• Pathfinding to Product Development: Spearheaded pathfinding projects for first-of-kind architectures, overseeing NPI and DOE to achieve successful technology building block demonstrations and development.

• Cross-functional Collaboration for Scalability: Collaborated with internal teams and external suppliers to manage technology integration, aligning building block objectives with product manufacturing requirements.

• Risk Assessment & Scalability Optimization: Implemented FMEA and strategic OKR management to mitigate risks, establish success metrics, and drive rapid development for scalable, high-yield productization.

• Comprehensive Quality & Reliability Oversight: Served as the lead for power delivery and first level interconnect (FLI) quality and reliability (QnR) across 2.5D/3D platforms. Developed predictive risk models to bridge gaps with external foundries and ensured high product standards from initial concept to full production.

• Resolution of Integrated Reliability Challenges: Leveraged model-based problem-solving (MBPS) techniques to resolve complex reliability issues stemming from interactions across multiple assembly processes. Leveraged failure analysis (FA) to identify and mitigate risks, ensuring long-term product reliability under varying mechanical and thermal stress.

• Design and integrate high quality ferroelectric oxide heterostructures with semiconductor by ALD or MBE for device applications with no nanoscale atomic interfacial diffusion.

• Hands-on experience in material characterization and failure analysis (FA), including integrated heterostructures, surface morphology, patterned structures, and thin film compositions by Focused Ion Bean (FIB), Scanning/TEM combining data analysis with Electron energy loss spectroscopy (EELS) with chemical and valence-state analysis.

• Collaborate across different schools/research labs with multi-disciplinary and multi-functional research groups.

• Design and integrate high quality ferroelectric oxide heterostructures with semiconductor by ALD or MBE for device applications with no nanoscale atomic interfacial diffusion.

• Hands-on experience in material characterization and failure analysis (FA), including integrated heterostructures, surface morphology, patterned structures, and thin film compositions by Focused Ion Bean (FIB), Scanning/TEM combining data analysis with Electron energy loss spectroscopy (EELS) with chemical and valence-state analysis.

• Collaborate across different schools/research labs with multi-disciplinary and multi-functional research groups.