Vancouver, British Columbia, Canada
▪ Invented a mechanism to automatically level 3D Printer platform with a precision of 100 microns (funded by National Research Council)
▪ Worked closely with CEO to define product features and specifications of next generation products
▪ Architected and developed hardware for 3D Printer comprised of ARM Cortex M7 microcontrollers, capacitive touchscreen, network connectivity, high speed flash storage, motor controllers, analog sensors, heater, accelerometer, ESD protection, DC/DC switching regulators, and custom power system.
▪ Performed high density layout with the latest SI optimization techniques for high speed interfaces. Fanned out fine-pitch BGA packages. Designed IC footprints.
▪ Established and maintained relationships with semiconductor and manufacturing vendors. Evaluated vendors and managed BOM.
▪ Performed power system, RF, and high-speed interface testing of prototype. Prepared technical documentation for FCC certification.
▪ System designed to have 50x performance leap to enable sophisticated application support
▪ Collaborated closely with the engineering team for firmware, mechanical integration, application software, and assembly-line production.